The challenge of the 3G phone to the PCB industry

　　The difference between the 3G and the previous two generation is to improve the speed of transmission of sound and data. It can handle a variety of media forms such as image, music, video stream and so on. It provides a variety of information services, including web browsing, teleconferencing, electronic commerce and so on. 3G can achieve three main businesses: mobility, interaction and distribution. It is a global satellite network connected anywhere and anytime.


The biggest highlight of 3G is the shared 2M bandwidth data service, which enables any user around the world to use small and cheap mobile stations to achieve global communication networking from land to sea to satellite, to ensure that global roaming users communicate with anyone anywhere, at any time, and to provide wired. The voice quality of telephone provides intelligent network services, multimedia, packet radio, entertainment and broadband services.


For the PCB industry, the rapid growth of 3G technology has also made the HDI PCB develop to new technology to meet the needs of 3G. At present, 3G communication is mainly based on 2+c+2 technology. With the enhancement of mobile phone function and the reduction of product size, the design of PCB is bound to become more and more to two, three and even more high density interconnect layers. Mobile phone function is increasing. On the premise of basic printed board area, HDI board has the following trends: first, it is basically two order HDI structure, part even needs three order HDI structure; two is the line width is about 75um / 75um, smaller is 50um / 50um; the smallest BGA holes are all 0.5mm, soon will be It is 0.4mm; three is the blind hole / burial hole of the stacked design needs electroplated copper filling hole or resin plug hole to ensure the reliability of interconnect and the flatness of the plate; four is the micro blind hole, the diameter of the hole and the diameter of the weld plate are getting smaller and smaller. The density of the laser hole of the whole plate is basically 70 thousand holes to 120 thousand holes / square feet. With 3G mobile becoming the "personal multimedia center", the three tier HDI is bound to become the mainstream of 3G mobile phone in the future.